J-std 033c

 

 

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J-STD-033C Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices Provides surface mount device manufacturers and users with IPC/JEDEC J-STD-033C-1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices A joint standard developed by the JEDEC Industry Standards IPC/JEDEC J-STD-020 and J-STD-033 to determine the moisture sensitivity level Changed to IPC-JEDEC J-STD-033C throughout document. methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the levels defined in J-STD-020. IPC/JEDEC J-STD-033C Industry Standard Handling and Storage for Moisture Sensitive Devices in Surface Mount Technology and Electronic Manufacturing. INDUSTRY. STANDARD. Standard for Handling,. Packing, Shipping and. Use of Moisture/Reflow. Sensitive Surface. Mount Devices. IPC/JEDEC J-STD-033. MAY 1999 J-STD-033D The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/ IPC/JEDEC J-STD-033C-1. Handling, Packing,. Shipping and Use of. Moisture/Reflow. Sensitive Surface. Mount Devices. A joint standard developed by the JEDEC

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